212535 - Assembler
Industry
MAN
Region
MA-Massachusetts
City
Chelmsford
State
MA
Rate
Up to $37.31 DOE
Duration
12 months
Description

Chipton-Ross is seeking an Assembler for a contract opportunity in Chelmsford, MA.

This position is 100% onsite.

RESPONSIBILITIES:
Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies. Duties include performing gold wire bonding using manual and automated 0.001" and 0.0007" machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals and other microelectronic components. This position requires wire bonding onto small pad sizes down to 0.001" in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.

This position will require the capability to troubleshoot defective hybrids circuit card assemblies by visually screening wire bonds or chip placement. Duties will also include installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies. It also requires the utilization of measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to assure that the unit conforms to specifications. Plans work sequence by assessing work in progress to schedule requirements. The position will also require collaboration with Manufacturing and Quality Engineering on procedures and troubleshooting methodologies.


REQUIRED EXPERIENCE:
o Experience in wire bonding and ribbon bonding (0.001" and 0.0007" wire and various sizes of ribbon)
o Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools
o Good dexterity and eye/hand coordination
o Experience in microelectronics assembly (chip and wire assembly)
o Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
o Ability to work in a diverse team environment; Good interpersonal, teaming and communication skills

DESIRED REQUIREMENTS:
o Experience in hybrid assembly in accordance with Mil STD 883
o Experience wire bonding or ribbon bonding to ceramic or duroid substrates
o Experience using Westbound and Metcal bonding machines and Unitech welder.
o Experience in substrate and component attach, auto pick-and-place
o Experience operating auto or manual bonding equipment
o Familiarity working in an ESD and FOD controlled environment
o Experience in mechanical assembly processes of small electronic devices
o Experience working on military products in ISO 9001 / AS9100 controlled environments

EDUCATION:
Accredited High School Diploma required

WORK HOURS:
Full-Time 4/10 work schedule 1st Shift

MISCELLANEOUS:
Applicants responding to this position will be subject to a government security investigation and must meet eligibility requirements by currently possessing the ability to view classified government information.

Employment will be contingent on clearing a drug screen and background check. Both must clear prior to start date.

Contact
Brent Sizemore
bsizemore@chiptonross.com
CHIPTON-ROSS, INC.
6926 Rivers Ave
North Charleston, SC 29406

Phone: (843) 554-5800 x185 or (800) 927-9318 x185

Candidates responding to this posting must currently possess the eligibility to work in the United States. No third parties please.

Employment will be contingent on candidate clearing pre-employment drug screen and background check.

Chipton-Ross provides equal employment opportunities to all employees and applicants for employment without regard to race, color, creed, religion, national origin, sex (including pregnancy), age, disability, sexual orientation, gender identity and/or expression, protected veteran status, genetic information, or any other characteristic protected by Federal, State or local law. This policy governs all areas of employment at Chipton-Ross, including recruiting, hiring, training, assignment, promotions, compensation, benefits, discipline, and terminations.