PCB Layout Designer 3

Chipton-Ross is seeking multiple PCB Layout Designer 3's for a contract opportunity in Cincinnati, OH.

Basic Qualifications for a Sr. Principal PCB Layout Designer:

• 8 Years with Bachelors in Science; 6 Years with Masters; 4 Years with PhD.
• Active Top-Secret clearance.
• Willingness and ability to work on?site full?time at the Cincinnati, OH location.
• Minimum 8 years of experience performing engineering/layout of printed circuit boards using Xpedition.
• Experience with the layout of multi?layer, high?density PCBs and circuit card assemblies, including placement and routing of high?speed digital, RF, and/or mixed?signal circuits.
• Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity.
• Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations.
• Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high?reliability criteria.
• Experience generating artwork and PCB/CCA documentation for procurement and assembly houses.
• Excellent organizational and problem?solving skills with a demonstrated ability to adapt effectively to changing requirements.

Basic Qualifications for a Staff PCB Layout Designer:

• 12 Years with Bachelors in Science; 10 Years with Masters; 8 Years with PhD.
• Willingness and ability to work on?site full?time at the Cincinnati, OH location.
• Minimum 12 years of experience performing engineering/layout of printed circuit boards using Xpedition.
• Experience with the layout of multi?layer, high?density PCBs and circuit card assemblies, including placement and routing of high?speed digital, RF, and/or mixed?signal circuits.
• Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity.
• Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations.
• Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high?reliability criteria.
• Experience generating artwork and PCB/CCA documentation for procurement and assembly houses.
• Excellent organizational and problem?solving skills with a demonstrated ability to adapt effectively to changing requirements.

• Execute the placement and routing of complex, high?density, multi?layer printed circuit boards (PCBs), including high?speed digital, RF, mixed?signal, and power circuits.
• Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized PCB layouts that meet performance, reliability, and manufacturability requirements.
• Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for procurement and assembly partners.
• Apply current IPC and high?reliability industry standards, as well as applicable military and aerospace criteria, in the design and verification of printed wiring boards and circuit card assemblies.
• Collaborate closely with electrical, mechanical, manufacturing, and signal integrity engineers to address layout?related design challenges involving signal integrity, power integrity, thermal management, and packaging.
• Support and perform Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews using automated and manual checks to improve yield, test coverage, and product robustness.
• Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs.
• Support PCB library management practices, ensuring correct use of symbols, footprints, and parameter data in accordance with internal workflows.
• Independently own PCB layout tasks from concept through fabrication data release in support of program cost, schedule, and technical requirements.
• Lead advanced PCB layout efforts using technologies such as High?Density Interconnect (HDI), microvias, via?in?pad, backdrilling, and specialized substrate materials; provide technical guidance, peer reviews, and mentoring to other layout designers.

• Prior experience on defense or space flight programs with stringent reliability, documentation, and traceability requirements.
• Demonstrated expertise in the layout of advanced, high?density, multi?layer printed circuit boards combining RF, high?speed digital, and high?power circuit sections.
• Knowledge of PCB process workflows and library management, including creation and governance of symbols, footprints, and reusable layout elements.
• Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules.
• Deep domain knowledge of high?reliability military and aerospace hardware criteria (e.g., MIL?PRF?31032, MIL?STD?883, IPC Class 3/3A), or comparable experience demonstrating equivalent rigor.

Bachelors in Science.

School must be accredited.

9/80 workweek. On-site.

Applicants responding to this position will be subject to a government security investigation and must meet eligibility requirements by currently possessing the ability to view classified government information.

• Applicants responding to this position will be subject to a government security investigation and must meet eligibility requirements by currently possessing the ability to view classified government information.
• Employment will be contingent on clearing a drug screen and background check. Both must clear prior to start date.
• Candidates responding to this posting must currently possess the eligibility to work in the United States. No third parties please.